Detector Scope Distribution
Electron Ion Collider
Detector Scope Distribution
This document identifies how Detector system scope is distributed within the EIC project.
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Categories include:
- a) scope that is assigned to various CD-3(A,B,C) phases,
- b) scope that is defined as "in-kind" where labor is provided by a collaborating institution,
- c) sources that are defined as "in-kind" where materials are provided by a collaborating institution,
- d) scope where materials will be re-used by design,
- e) scope that has internal dependencies (within the detector),
- f) scope that has external dependencies (between the detector and other sub-systems),and
- g) scope that has portfolio dependencies (outside of the EIC project).
| WBS Scope | CD-3 Scope Items | CD-3A Scope Items | CD-3B Scope Items | CD-3C Scope Options | In-Kind Scope | In-Kind Source | Reuse Scope | Internal Dependency | External Dependency | Portfolio Dependency | |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 6.03.01.02: Tracking | |||||||||||
| 6.03.01.02.01: Silicon Tracking | disks, sensors, ancillary ASIC, mechanical structures | IB (full) & OB (labor) | INFN, UK | VTRx+/lpGBT (electronics) | beam pipe | BNL: Clean room for testing of half-barrels (IB, staves (OB) and half disks after transport and for final assembly | |||||
| 6.03.01.02.02: Gaseous MPGD Tracking | Barrel outer tracker, backward disks, detector gas systems | CYMBAL (full), forward disks (full) | CEA, INFN | SALSA ASIC and HV/LV/readout (electronics); support systems of hpDIRC (I^3), of BTOF (PID) and PST (in Silicon tracking) | BNL: Gas distribution system; Clean room for repair and test of CYMBAL modules, outer barrel trracker modules, and forward/backward quarter-disks; JLab: Lab space and Class-1000 Clean Room for barrel outer tracker assembly | ||||||
| 6.03.01.03: Particle Identification | |||||||||||
| 6.03.01.03.01: High-Performance DIRC | PED, boxes, glued bars, lightguides (1/3), lenses, prisms, readout mechanics, HRPPDs | bar refurbishment (6 boxes) | HRPPDs? | ex-BABAR DIRC bars for glued bars, partial lightguides (2/3) | support frames (I^3), dry N2 supply (I^3), FCFD-variant and HV/LV/readout (electronics) | JLab: Laser hut for QA of bars, assembly space for hpDIRC boxes | |||||
| 6.03.01.03.02: Dual RICH | Mirrors, gas (C2F6) | Mirrors? | Everything else, including gas circulation system (I^3), ALCOR and FEB/RDO for electronics) | INFN | VTRx+ (electronics), support structure and movement systems (I^3) | BNL: Clean room (class 100000) for assembly of dRICH | |||||
| 6.03.01.03.03: Proximity-Focusing RICH | PED, aerogel, mirrors, frame, HRPPDs | HRPPDs? | support frames (I^3), dry N2 supply (I^3), FCFD-variant and HV/LV/readout (electronics) | BNL: Clean tent for assembly of pfRICH | |||||||
| 6.03.01.03.04: Time-Of-Flight Detectors | |||||||||||
| 6.03.01.03.04.01: Barrel TOF | 1/4 of assembly | AC-LGAD sensors and staves, flex-PCBs, interposers, 3/4 of assembly | Japan | FCFD ASICs, VTRx+/lpGBT, and HV/LV/readout (electronics); support structures and cooling (in CTOF) | BNL: dust-free space for stave assembly, access to wire bonding gantry | ||||||
| 6.03.01.03.04.02: Forward TOF | 1/2 of assembly | AC_LGAD sensors, modules, 1/2 of assembly | Taiwan | EICROC ASICs and HV/LV/readout (electronics); support structures and cooling (in CTOF) | BNL: dust-free space for assembling modules on support structure | ||||||
| 6.03.01.03.04.03: Common TOF Systems | BTOF support structure and cooling; FTOF Support structure and cooling | Japan | |||||||||
| 6.03.01.04: EM Calorimetry | |||||||||||
| 6.03.01.04.01: Backward EM Calorimeter (EEEMCAL) | |||||||||||
| 6.03.01.04.01.01: Blocks | 830 crystals | 1069 crystals | 1000 crystals | QA labor | NSF | JLab: clean room for QA of cystals | |||||
| 6.03.01.04.01.02: Light Sensors | SiPMs, SiPM boards | beam tests | NSF, France IN2P3 | ||||||||
| 6.03.01.04.01.03: Mechanical Structure | Frame, cooling, module assembly&stacking | PED, frame, cooling, stacking | France IN2P3 | CD3A/B/C, electronics, HV/LV, cooling support, readiness for integration | BNL: Available space for component delivery and storage, module/sector assembly, detector stacking and tests (in IP6 Assembly Hall) | ||||||
| 6.03.01.04.02: Barrel EM Calorimeter (BIC) | |||||||||||
| 6.03.01.04.02.01: Sampling Sectors | Fibers 2511km, Pb and Al sheet, Epoxy, Carbon fiber frames; Sector production | Fibers 1125km | Fibers 1264km | 1/2 sectors (including material) | Korea MSIT/KbSI | ||||||
| 6.03.01.04.02.02: Light Sensors | SiPMs, SiPM boards | SiPMs, SiPM boards | Canada | ||||||||
| 6.03.01.04.02.03: Imaging Planes | 1/2 astropix | 1/2 astropix | Korea MSIT/KbSI | Clean room at production site | |||||||
| 6.03.01.04.02.04: Mechanical Structure | End-of-sector-boxes, sector assembly | End-of-sector-boxes | Canada | CD3A/B/C, electronics, HV/LV, cooling support, readiness for integration | BNL: Available space for component delivery and storage, module/sector assembly, detector stacking and tests (in IP6 Assembly Hall) | ||||||
| 6.03.01.04.03: Forward EM Calorimeter (fECAL) | |||||||||||
| 6.03.01.04.03.01: Blocks | Fibers 935km, W powder, Epoxy, Meshes; Block production | Fibers 1000km | Fibers 1065km | ||||||||
| 6.03.01.04.03.02: Light Sensors | SiPMs, SiPM boards | ||||||||||
| 6.03.01.04.03.03: Mechanical Structure | Light Guides, Cooling, Assembly, Stacking | CD3A/B/C, electronics, HV/LV, cooling support, frame/plate for module stacking | BNL: Available space for component delivery and storage, module/sector assembly, detector stacking and tests (in IP6 Assembly Hall) | ||||||||
| 6.03.01.05: Hadronic Calorimetry | |||||||||||
| 6.03.01.05.01: Backward Hadronic Calorimeter | 1140 fully equipped absorber modules | BNL: assembly space | |||||||||
| 6.03.01.05.02: Barrel Hadronic Calorimeter | SiPMs, SiPM boards 470 replacement scintillator tiles modifications (3 sectors) | sPHENIX OHCal sectors | BNL: refurbishment space | ||||||||
| 6.03.01.05.03: Forward Hadronic Calorimeter | two insert modules: absorber structure 6,790 SiPM (1.3 mm) 6,790 scintillator tiles 120 SiPM boards transfer boards | 650 8M-modules 341,380 SiPM (1.3 mm) | 200 8M-modules | 216 8M-modules 72 4M-modules 568,190 scintillator tiles 175,420 SiPM (1.3 mm) 51,390 SiPM (3 mm) 78,970 SiPM flex-boards with LEDs 1150 transfer boards 1150 summing boards wrapping material (reflective & support) labor for wrapping | BNL: staging area before installation | ||||||
| 6.03.01.06: Detector Solenoid Magnet | PED, oversight, field map and testing | magnet vendor oversight, conductor | power supply | magnet contract | INFN | flux return steel (in LFHCAL and in I^3) | cryo capability and cryo distribution | BNL: cooling water and power provision | |||
| 6.03.01.07: Electronics | ASICS: FCFD, FCFD-variant, discrete readout; HV/LV/FEBs and fibers; patch panels. | VTRx+/lpGBT | ASICS: CALOROC, EICROC (fab), SALSA, ALCOR; readout for dRICH, CYMBAL and forward MPGD disks | France IN2P3, France CEA, INFN | Cable trays, platforms for racks, power, cooling (I^3) | BNL: Lab space for integrated electronics and DAQ chain tests | |||||
| 6.03.01.08: DAQ/Computing | |||||||||||
| 6.03.01.08.01: Data Acquisition | GTU, DAM boards (FELIX), DAQ computing, networking, trunk fibers | BNL: Lab space for integrated electronics and DAQ tests; BNL Computer Center space for computing and fiber optics to connect to DAQ room | |||||||||
| 6.03.01.08.02: Slow Controls Integration | general computing and networking | Control GUI | France CEA | Lab space for controls development | |||||||
| 6.03.01.09: Integration, Installation, and Infrastructure (I^3) | |||||||||||
| 6.03.01.09.01: Barrel Detector Structures | support structures, installation tooling, integration for Barrel detectors | sPHENIX Hydraulics, Hillman rollers, Cradle Plates, Platforms, DIRC/MPGD Installation Tooling, Magnet supports | BNL: 1) RHIC R&R of Bldg 1006; 2) Concrete Floor Modifications; 3) Labor Pool: Carpenters, Riggers, etc.; 4) Temporary storage of equipment and parts before installation. | ||||||||
| 6.03.01.09.02: Endcap Structures and Moving Mechanisms | support structures, installation tooling, moving mechanism for Forward and Backward Endcaps | Flux Return Steel for Forward Endcap | Flux Return Steel for Backward Endcap | CD-3B Flux Return Steel | BNL: 1) RHIC R&R of Bldg 1006; 2) Concrete Floor Modifications; 3) Labor Pool: Carpenters, Riggers, etc.; 4) Temporary storage of equipment and parts before installation. | ||||||
| 6.03.01.09.03: Infrastructure and Utilities Integration | Various utilities needed for the Detector, magnet and subdetector components. Infrastructure modification needed for moving or anchoring of Barrel or Endcaps. Modifications to any ancillary equipment. | STAR Electronics and Utility Platforms, | BNL: 1) RHIC R&R of Bldg 1006; 2) Concrete Floor Modifications; 3) Other Off-Project Work - HVAC, etc. 4) Labor Pool: Carpenters, Riggers, etc.; 5) Temporary storage of equipment and parts before installation. | ||||||||
| 6.03.01.10: Auxiliary Detectors | |||||||||||
| 6.03.01.10.01: Roman Pots and Off-Momentum Detectors | AC-LGAD sensors and staves, moving stages, support structure | PED, frame, cooling | IN2P3 | EICROC,VTRx+/lpGBT and HV/LV/readout (electronics) | vacuum system (scattering chambers) | BNL: clean room for QA, assembly of staves | |||||
| 6.03.01.10.02: B0 Detectors | AC-LGAD sensors and staves, installation and support structures | lead-tungstate crystals and frame, QA labor for AC--LGADs | Israel | EICROC and CALOROC,VTRx+/lpGBT and HV/LV/readout (electronics) | BNL: clean room for QA, assembly of staves | ||||||
| 6.03.01.10.03: Zero Degree Calorimeter | Scintillating tiles and PCB boards for HCAL, support structure | lead-tungstate crystals and frame, SiPMs for EMCal and HCAL sections | Taiwan, Japan | Iron Blocks (from STAR) for HCAL | CALOROC and HV/LV/readout (electronics) | ||||||
| 6.03.01.10.04: Low-Q2 Detectors | support structure | PED, WSciFi calorimeter, TimePix, Silicon modules, SiPMs/boards, frame, cooling, moving stages | UK | CALOROC and HV/LV/readout (electronics) | scattering chamber with thin window | ||||||
| 6.03.01.10.05: Luminosity Monitor | AC-LGAD sensors and staves, SiPMs/boards, dipole magnets, low-vacuum chamber, support structure | PED, WSciFi calorimeters (+ QA labor on AC_LGAD) | UK (+ Israel) | CALOROC and HV/LV/readout (electronics) | exit window for photons | BNL: clean room for QA, assembly of staves | |||||
| 6.03.01.11: Polarimetry | |||||||||||
| 6.03.01.11.01: Electron Polarimetry | |||||||||||
| 6.03.01.11.01.01: ESR Polarimeter | Diamond detectors, photon calorimeter, laser system, detector stands, laser table, mini-DAQ | Beamline interfaces (laser, scattered electron and photon exit) | BNL: laser room outside ESR | ||||||||
| 6.03.01.11.01.02: RCS Polarimeter | Diamond detectors, photon calorimeter, laser system, detector stands, laser table, mini-DAQ | Beamline interfaces (laser, photon exit) | |||||||||
| 6.03.01.11.02: Hadron Polarimetry | |||||||||||
| 6.03.01.11.02.01: HJET Polarimeter | Upgrade and integration of existing HJET polarimeter, including refurbishment and upgrade of polarized hydrogen jet system, recoil detector systems, vacuum/target hardware, and DAQ/controls | RHIC HJET polarimeter | Beam-line interfaces for installation and operation within hadron polarimetry section | BNL: test areas in Building 510 for device upgrades and system checkout | |||||||
| 6.03.01.11.02.02: pCarbon Polarimeter | Upgrade and integration of existing pCarbon polarimeter, including refurbishment and upgrade of carbon target system, recoil detector systems, support hardware, and DAQ/controls | RHIC pCarbon polarimeters | Interfaces with beam lines and with IP6 location where one pCarbon polarimeter will be installed | BNL: test areas in Building 510 for device upgrades and system checkout | |||||||
| 6.03.01.12: Detector Non-Beam Commissioning | Labor and consumables for cosmics tests | ||||||||||